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CT system Product List

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Microfocus X-ray fluoroscopy and CT system 'CheetahEVO'

Microfocus X-ray fluoroscopy and CT system 'CheetahEVO'

Equipped with a multi-focus X-ray tube! Effective for various applications such as resin parts, rubber parts, and metal parts.

The "Cheetah EVO" is a micro-focus X-ray fluoroscopy and CT system with dimensions of W1,650×D1,400×H2,050mm. It is equipped with a multi-focus X-ray tube that combines nano-focus mode and high-output mode. In addition to its outstanding expressive power provided by the 16-bit (65,000 gradation) flat panel detector, it is effective for various applications, including not only electronic components but also resin parts, rubber parts, and metal parts. 【Features】 ■ Equipped with a multi-focus X-ray tube that combines nano-focus mode and high-output mode ■ Outstanding expressive power from a 16-bit (65,000 gradation) flat panel detector ■ Effective for various applications Company Name: YXLON *For more details, please refer to the PDF document or feel free to contact us.

  • Measurement and Analysis Equipment
  • Non-destructive testing
  • CT system

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3D X-ray CT system "3DCT Series"

3D X-ray CT system "3DCT Series"

Capable of handling a wide range of work from high power to low power!

The "3DCT Series" is a three-dimensional X-ray CT system that utilizes our unique technology, the U-Centric (focus-centered rotation) function, allowing for 360-degree perspective observation and high-magnification CT imaging of the focused point with "microscopic vision" and even "nanoscopic vision." We offer a lineup that includes the ultra-high-resolution model "XVA-160αII," which achieves ultra-high magnification (2,000 times) and a nano-order focus size (250/800nm), as well as the standard model "XVA-160R" and the wide-range model "Si-230/300." These systems are widely adopted for the non-destructive analysis of compact, high-density, and multi-layered high-function electronic components with high precision. 【Features of "XVA-160αII 'Z'】 This ultra-high-resolution model achieves ultra-high magnification (2,000 times) and nano-order size (250/800nm). There are imaging examples such as transmission images and tomographic images of fingerprint sensors, as well as tomographic images of electromigration. It is equipped with numerous features, including the U-Centric function, optical axis, rotation center, and automatic focus adjustment functions. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Non-destructive testing
  • CT system

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X-ray CT system imaging example: CT cross-section of solder cracks

X-ray CT system imaging example: CT cross-section of solder cracks

Introducing a case study of tomographic imaging of solder cracks inside semiconductors captured using a micro-focus X-ray CT system!

The micro-focus X-ray CT system 'XVA-160RZ' is an X-ray CT system that can visualize high-resolution fine internal structures used in applications such as non-destructive testing and material analysis. You can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system 'XVA-160RZ'! It is a case where a cross-section of solder cracks inside a semiconductor was captured. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack

[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack

This is a case where a micro-focus X-ray CT system XVA-160RZ was used to perform CT imaging of an interposer substrate, detecting solder cracks.

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only facilitates efficient analysis work but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

  • Non-destructive testing
  • CT system

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【UHS_X-ray CT System Imaging Case】FET Observation Case

【UHS_X-ray CT System Imaging Case】FET Observation Case

This is a case where a FET was CT imaged using the Micro Focus X-ray CT system XVA-160RZ, and voids were detected.

This is an example of a FET (Field Effect Transistor) captured using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder at the mounting part overlaps with the solder under the chip. Therefore, by performing CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Example] QFP_Wire

[UHS_X-ray CT System Imaging Example] QFP_Wire

This is a case of performing orthogonal CT imaging of the wire bonding section inside a QFP using the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It is possible to closely observe even the indentations from the second bonding of the wires. The XVA-160RZ allows for easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board

[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board

This is a case of CT imaging of a smartphone's internal circuit board. It is possible to observe the patterns and structures of each internal layer.

The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also visible in a way unique to CT imaging.

  • Non-destructive testing
  • CT system

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Germany Compact Micro Nano Industrial CT System diondo d1

Germany Compact Micro Nano Industrial CT System diondo d1

Ideal for analysis and measurement of small and medium sizes. By adopting a high-performance transmission X-ray source, it achieves four times the resolution compared to conventional methods in the same measurement time.

The diondo d1 is a high-resolution micro-nano CT system specially designed for the analysis and measurement of small and medium-sized components. Compared to conventional systems, the d1 can achieve up to 4 times the resolution in the same measurement time by using a high-output transmission X-ray source, and it can reduce the measurement time to 1/4 at the same resolution. Its very high transmission output also enables the analysis of challenging material combinations in new energy vehicle applications, such as new energy batteries. ● Short time, high resolution ● Highest accuracy, maximum detection volume ● High-precision granite machine system ● Coordinate measurement technology ● Advanced scan modes

  • Other analytical equipment
  • Non-destructive testing
  • Analysis and prediction system
  • CT system

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High-output X-ray CT system "CT Compact"

High-output X-ray CT system "CT Compact"

High-output 450kV mini-focus X-ray tube! Compatible with a wide variety of samples.

The "CT Compact" is a high-output X-ray CT system that accommodates a wide variety of samples, from high-density workpieces such as castings to composite modules. It uses a high-output 450kV mini-focus X-ray tube. It can be equipped with two types of detectors: a line detector that minimizes the influence of scattered rays and a flat panel detector (optional). 【Features】 ■ Accommodates a wide variety of samples, from high-density workpieces such as forged products to composite modules ■ High-output 450kV mini-focus X-ray tube ■ Two types of detectors can be installed Company name: YXLON *For more details, please refer to the PDF document or feel free to contact us.

  • Measurement and Analysis Equipment
  • Non-destructive testing
  • CT system

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High-resolution measurement X-ray CT system 'FF35 CT'

High-resolution measurement X-ray CT system 'FF35 CT'

Introducing a high-resolution measurement X-ray CT system featuring low thermal expansion granite stages!

The "FF35 CT" is a high-resolution measurement X-ray CT system capable of accommodating two types of X-ray tubes: a reflection type at 225kV and a transmission type at 190kV (optional). It can handle a wide variety of samples, from fine work such as CFRP to small electronic components and cast parts. As an option, we offer a measurement accuracy of 8μm + L/75 [L = mm] (for measurement use) and a helical CT suitable for imaging laminated materials. 【Features】 ■ Supports a wide variety of samples ■ Capable of accommodating two types of X-ray tubes ■ Measurement accuracy of 8μm + L/75 [L = mm] (measurement CT option) ■ Helical CT suitable for imaging laminated materials (optional) ■ Granite stage with low thermal expansion rate Company Name: YXLON *For more details, please refer to the PDF document or feel free to contact us.

  • Measurement and Analysis Equipment
  • Non-destructive testing
  • CT system

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【UHS_X-ray CT System Imaging Case】QFP Observation Case

【UHS_X-ray CT System Imaging Case】QFP Observation Case

This is a case of CT imaging of a QFP using the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the internal chip patterns. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Example] Electrolytic Capacitor

[UHS_X-ray CT System Imaging Example] Electrolytic Capacitor

This is a case of CT imaging of an electrolytic capacitor using the Micro Focus X-ray CT system XVA-160RZ.

This is a case of a conductive polymer aluminum solid electrolytic capacitor imaged using transmission imaging and oblique CT scanning. It allows for the confirmation of internal structures and observation of solder conditions. The XVA-160RZ is a standard model that can widely observe various defects in a diverse range of workpieces. Additionally, it is a device that can contribute to the efficiency of analysis, as it can perform CT scanning in just three and a half minutes.

  • Non-destructive testing
  • CT system

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【UHS_X-ray CT System Imaging Case】Heated Tobacco

【UHS_X-ray CT System Imaging Case】Heated Tobacco

This is a case of transmission imaging of heated tobacco using the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a heated tobacco product captured through transmission imaging. It allows for understanding the internal substrate condition and structure. The XVA-160RZ can perform orthogonal CT imaging easily by simply attaching a dedicated unit without changing the stage. Similar to oblique CT, orthogonal CT can also be captured at high magnification.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Case] First Generation Smartphone

[UHS_X-ray CT System Imaging Case] First Generation Smartphone

This is a case of the first-generation smartphone captured with a transparent image and oblique CT scan. It allows for the observation of the internal structure and the condition of the internal memory.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"!

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Case] Smartphone (2018)

[UHS_X-ray CT System Imaging Case] Smartphone (2018)

This is a case of a smartphone (2018 model) that was imaged using transparent imaging and angled CT scanning. It allows for the observation of the internal structure and the condition of the internal memory.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce shooting examples of the micro-focus X-ray CT system "XVA-160RZ"! On a separate page, we have published the first-generation smartphone. Changes in the internal structure can be observed comparatively.

  • Non-destructive testing
  • CT system

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[UHS_X-ray CT System Imaging Example] microSD WB

[UHS_X-ray CT System Imaging Example] microSD WB

This is a case of wire bonding imaged using the "NanoFocus X-ray CT System XVA-160αII 'Z'."

This is an example of an image taken with oblique CT of microSD wire bonding. The wire bonding can be clearly observed. The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is a super high-resolution model that achieves ultra-high magnification (2,000 times) and nano-order sizes (250/800nm).

  • Non-destructive testing
  • CT system

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Germany Large High-Power Industrial CT System diondo d4

Germany Large High-Power Industrial CT System diondo d4

Compact computer tomography inspection system for high-density medium to large parts.

The diondo d4 is a large high-output CT system specialized for high-resolution three-dimensional measurement of medium to large parts such as cylinder heads, crankcases, and high-density samples (turbine blades). The computed tomography system requires minimal space, making it easy to integrate into existing production or laboratory environments, and thanks to the plug-and-play principle, the system can be used immediately after installation. ▪ High-performance X-ray tube with a maximum of 600kV Provides sufficient penetration even for highly absorbent samples ▪ Compact design Achieves a compact system by integrating peripheral devices ▪ Stable 3K detector Realizes more detailed detection capabilities with shorter measurement times

  • Other analytical equipment
  • Non-destructive testing
  • Analysis and prediction system
  • CT system

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Germany small high-precision industrial CT system diondo d evo03

Germany small high-precision industrial CT system diondo d evo03

A friendly CT system that accommodates complex measurement and inspection tasks.

The evo 03 system can reliably perform analysis and precise measurements of medium and small-sized parts made from materials such as plastics, ceramics, and light metals. The simplification of the system's operation allows anyone, even without deep knowledge, to analyze the interior of objects and quickly and efficiently measure their overall contours. Advantages ●Ease of Use This system is designed from both hardware and software perspectives, focusing only on what is necessary without compromising quality. ●Accuracy The compact and minimal system design achieves a resolution of up to 56 μm and high reproducibility, making it ideal for precise measurement tasks. ●Benefits This system is perfect for those who want to take the first step into the world of computer tomography or are seeking technical solutions due to the limitations of tactile and optical measurement systems regarding the problem at hand. ●Simple and Flexible With a simplified structure, materials with high absorption levels can also be inspected with high quality. ●Cost-Effectiveness The system is offered as a plug-and-play model, allowing you to start using it immediately after a short training session.

  • Other analytical equipment
  • Non-destructive testing
  • Analysis and prediction system
  • CT system

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Germany diondo Industrial CT Measurement Service - Geology

Germany diondo Industrial CT Measurement Service - Geology

Low cost, high precision, accurate non-destructive testing from 50,000 yen per sample.

Starting from 50,000 yen (excluding tax) per sample *Sample transportation costs (generally, the customer is responsible for sample transportation expenses) 【Measurement Contents】 Defect - Pore Analysis Dimensional Measurement *For other measurement contents, please inquire. 【Delivery Data】 Measurement Report + Original Report Image + Defect Statistics Table 【CT Scanner Specifications】 Model Name: General Micro/Nano CT System diondo d2 Reflection Target X-ray Tube: 190-300kV Transmission Target X-ray Tube: 160-300kV Area Array Detector: 3000 × 3000px, 139μm Focal Length Range: 400-1200mm, adjustable Maximum Effective Detection Range: Ø520×H650mm Maximum Load Capacity: 50kg diControl Software Features: DR Function, Spiral CT, Angle Limited Scan, High-Speed CT, High-Speed Reconstruction GPU Acceleration, Beam Hardening Correction, Artifact Correction, Batch Auto Detection, Automatic Geometry Correction, Daily Detection, Status Detection, Measurement Module VDI/VDE 2630 【Inquiries & Estimates】 Email: info@nd-seiko.co.jp Phone: 0538-84-9600

  • Geological Survey
  • Surveying
  • Non-destructive testing
  • CT system

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3D X-ray CT system 'XVA-160RA/160αII "Z"'

3D X-ray CT system 'XVA-160RA/160αII "Z"'

Easily achieve high magnification observation with the unique technology "User-Centric Mechanism." New products are showcased at "Electro Test Japan."

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," enabling easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus allows for high-magnification tomographic imaging. This enables detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Allows for clear observation of details at a magnification of 1,600 times ■ Includes visible light mapping function and automatic focus adjustment function ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size 200nm and above) ■ Allows for precise observation of detailed structures at a magnification of 2,000 times ■ Includes a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus ★ Our company will exhibit at "Electrotest Japan," held at Tokyo Big Sight from January 22 (Wednesday).

  • Non-destructive testing
  • CT system

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【X-ray CT system imaging example】CT tomography with a smartphone-mounted CPU

【X-ray CT system imaging example】CT tomography with a smartphone-mounted CPU

Introducing a CT imaging case of a smartphone-mounted CPU captured with a micro-focus X-ray CT system!

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, users can choose between a high-resolution type and a wide-field type. This time, we would like to introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"! It is a case where a CT scan of a smartphone-mounted CPU was performed. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis tasks Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

  • Non-destructive testing
  • CT system

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